型号 TMSDVC5416GGUR160
厂商 Texas Instruments
描述 IC FIXED POINT DSP 144-BGA
TMSDVC5416GGUR160 PDF
代理商 TMSDVC5416GGUR160
标准包装 1,000
系列 TMS320C54x
类型 定点
接口 主机接口,McBSP
时钟速率 160MHz
非易失内存 ROM(32 kB)
芯片上RAM 256kB
电压 - 输入/输出 3.30V
电压 - 核心 1.60V
工作温度 -40°C ~ 100°C
安装类型 表面贴装
封装/外壳 144-LFBGA
供应商设备封装 144-BGA MICROSTAR(12x12)
包装 托盘
同类型PDF
TMS-FET470A256 Texas Instruments DEV KIT KICKSTART TMS470
TMS-SCE-1/2-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1/4-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1/8-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/2-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-3 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-6 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-S1-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/2-2.0-S3-9 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-3 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-6 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-S1-4 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/4-2.0-S1-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/4-2.0-S3-9 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-6 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-7 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-8 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-9 TE Connectivity HEAT SHRINK SLEEVE